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Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2001062626
Kind Code:
A
Abstract:

To provide a cutting device which can cut easily and smoothly even the raw material with a thin plate thickness.

In this cutting device, a shear angle θ1 is made on the corner 12B of a punch 12. Thereby, the cutting of a raw material 10 is carried out smoothly and easily without generating a dangling at the cutting time even if the clearance of the angle parts 12B, 52A against the plate thickness of the thin raw material 10 is large. As the angle part 12B is nearly in a point contact state against the raw material 10, the load added to the raw material 10 becomes small and the cutting of the raw material 10 is carried out smoothly and easily. Therefore, as the folding by the dangling when the thin raw material 10 is cut as usual and a halfway cutting are prevented, the work efficiency is improved and the waste of the raw material 10 is prevented.


Inventors:
IWABUCHI YOETSU
Application Number:
JP23680999A
Publication Date:
March 13, 2001
Filing Date:
August 24, 1999
Export Citation:
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Assignee:
AIWA CO
International Classes:
B26D1/08; B23D35/00; (IPC1-7): B23D35/00; B26D1/08
Attorney, Agent or Firm:
Atsushi Nakajima (3 outside)



 
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