Title:
CUTTING GRIND STONE
Document Type and Number:
Japanese Patent JP2017047502
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress generation of chipping and consumption of a cutting grind stone in cutting work.SOLUTION: The cutting grind stone 65 includes a diamond abrasive grain and a boron compound, where an average grain diameter of the diamond abrasive grain is within a range of 5 μm or more and 50 μm or less and an average grain diameter of the boron compound is larger than one fifth and smaller than one half of the average grain diameter of the diamond abrasive grain.SELECTED DRAWING: Figure 1
Inventors:
UMAJI RYOGO
OSHIMA RYUJI
ISHIAI YOSHIKI
OSHIMA RYUJI
ISHIAI YOSHIKI
Application Number:
JP2015172664A
Publication Date:
March 09, 2017
Filing Date:
September 02, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24D5/12; B24D3/00; B24D3/06; B24D3/28
Domestic Patent References:
| JP2012056012A | 2012-03-22 | |||
| JPS4919491A | 1974-02-20 |
Foreign References:
| US20100000159A1 | 2010-01-07 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office