Title:
CUTTING METHOD
Document Type and Number:
Japanese Patent JP2015139860
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method capable of reducing a fear of the adhesion of cutting chips to work, and suppressing the generation of chipping on the work.SOLUTION: On a blade cover 13 provided on a cutting device 1 used for a cutting method, a discharge port 136 communicating with a slit-shaped opening portion 132 and connected to a suction source 14 is formed. Therefore, if a cutting step is executed, a cutting liquid 155 including cutting chips can be discharged to the outside from the discharge port 136, and a fear of adhesion of the cutting chips on an upper surface of work W can be reduced. In the cutting step, the suction source 14 is actuated, and even if negative pressure is generated in cavities 17a and 17b formed around the slit-shaped opening portion by being surrounded by the cutting liquid 155 supplied to an upper surface Wa of the work W and the work W is floated, the pressurized cutting liquid 155 is supplied on the upper surface Wa of the work W, so that the floating of the work W is suppressed, and the generation of chipping on the work W can be suppressed.
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Inventors:
SEKIYA KAZUMA
Application Number:
JP2014015446A
Publication Date:
August 03, 2015
Filing Date:
January 30, 2014
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23Q11/00; B23Q11/10; B24B27/06; B24B55/02; B24B55/04; B24B55/06; H01L21/301
Domestic Patent References:
JP2009099940A | 2009-05-07 | |||
JP2011042009A | 2011-03-03 | |||
JPH09262737A | 1997-10-07 | |||
JP2007207865A | 2007-08-16 | |||
JP2009285769A | 2009-12-10 | |||
JP2007083392A | 2007-04-05 |
Foreign References:
US8449356B1 | 2013-05-28 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
Kyoko Kawamura
Isao Sasaki
Ken Kubo
Kyoko Kawamura
Isao Sasaki
Ken Kubo
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