Title:
除湿剤容器
Document Type and Number:
Japanese Patent JP4270646
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the efficiency of a process to form a heat-bondable resin layer by forming the heat-bondable resin layer of a water-soluble emulsion type resin. SOLUTION: A heat-bondable resin layer 13 is formed by using a water-soluble emulsion type resin. By this constitution, when a gas barrier film 1 comprising a picture layer 14, a biaxially oriented polyethylene terephthalate film 11 and the heat-bondable resin layer 13 is manufactured, the heat-bondable resin layer 13 can be formed by using the water-soluble emulsion type resin on the surface of an aluminum deposited layer 12 by an in-line process with a printing process wherein the picture layer 14 is printed on the film surface of the biaxially oriented polyethylene terephthalate film 11 having the aluminum deposited layer 12. Therefore, a process to form the heat-bondable resin layer 13 does not need to be separately provided, and this container can be efficiently manufactured by reducing the manufacturing processes.
Inventors:
Shin Yamada
Application Number:
JP14388899A
Publication Date:
June 03, 2009
Filing Date:
May 24, 1999
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65D77/20; B32B1/02; B32B5/18; B32B7/06; B32B7/12; B32B15/08; B32B15/09; B32B27/00; B65D53/00; B65D81/26
Domestic Patent References:
| JP9315402A | ||||
| JP4163394A | ||||
| JP10157769A | ||||
| JP9314725A | ||||
| JP11049226A |
Attorney, Agent or Firm:
Satoshi Kanayama
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