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Title:
SUPERCONDUCTING THIN FILM GRAIN BOUNDARY JUNCTION ELEMENT AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0653561
Kind Code:
A
Abstract:

PURPOSE: To realize a superconducting thin film grain boundary junction element having a small leakage current of a junction by so forming an LnBa2Cu3Ox film on a single crystalline region that orientation axes perpendicular to a base are different on single crystal regions.

CONSTITUTION: A mask material 6 is placed on an SrTiO3 substrate 1 having 1.1% of a lattice mismatching rate with YBa2Cu3Ox, a PrGaO3 2 having 0.02% of a lattice rate is deposited on the other part, the material 6 is then removed, and a YBa2CU3Ox thin film 3 is deposited on the entire substrate l at 750°C of a substrate temperature. Then, the film 3 in which a c-axis is oriented is deposited on the substrate l, and a YBa2Cu3Ox film 4 in which an a-axis is oriented is deposited on the film 2. In this case, a grain boundary junction 5 is formed at a boundary region between the films 3 and 4. Accordingly, the junction 5 is formed so that a CuO2 surface in which a current flows is brought into vertical contact to reduce a leakage current, and can be easily realized with high yield.


Inventors:
MUKODA MASASHI
MIYAZAWA SHINTARO
KOBAYASHI JUNYA
Application Number:
JP22077892A
Publication Date:
February 25, 1994
Filing Date:
July 28, 1992
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01L39/22; H01L39/24; (IPC1-7): H01L39/22; H01L39/24
Domestic Patent References:
JPH01161880A1989-06-26
JPH0446098A1992-02-17
JPH04144994A1992-05-19
JPH04318984A1992-11-10
JPH05267735A1993-10-15
JPH05267736A1993-10-15
Attorney, Agent or Firm:
Fukumori Hisao