PURPOSE: To provide a substrate polishing equipment which does not make the film thickness asymmetrical in polishing direction in the region between patterns obtained after polishing work.

CONSTITUTION: In a substrate polishing equipment for polishing and flattening a surface 14a where a pattern layer and the upper layer film of a wafer 14 is formed, provided are a polishing surface table 12 equipped with a polishing pad 13, a vacuum sucking table 15 for holding a wafer 1, a rotating table 16 for relatively turning a polishing surface table 12 and a vacuum absorbing table 15, and a control portion 10 for reversing the rotating direction of the rotating table 16.