Title:
【発明の名称】熱融着性組成物、その使用、およびこの組成物から製造される閉塞栓
Document Type and Number:
Japanese Patent JP2002521521
Kind Code:
A
Abstract:
The invention concerns a heat sealing composition including an adhesive framework and a framework forming constituent, the adhesive constituent being a maleic vinyl-anhydride ethylene-acetate polymer or a vinyl ethylene-acetate polymer modified to have epoxy functions and the framework forming constituent being selected from among a block polyether amide, modified or not, and a block polyether ester. The composition is useful for making closure plugs.
Inventors:
Leon, Jean-Pierre Rene
Viglow, Philip
Clown, Jean-Michel
Viglow, Philip
Clown, Jean-Michel
Application Number:
JP2000561272A
Publication Date:
July 16, 2002
Filing Date:
July 19, 1999
Export Citation:
Assignee:
RAPID S A
International Classes:
B62D25/24; B65D39/00; C08L23/04; C08L23/10; C08L23/16; C08L31/04; C08L67/02; C08L77/00; C09J123/00; C09J151/06; B65D39/04; C09J173/00; (IPC1-7): C09J123/00; B65D39/04; C08L23/04; C08L23/10; C08L23/16; C08L31/04; C08L67/02; C08L77/00; C09J173/00
Attorney, Agent or Firm:
Mitsuteru Soga (7 outside)