Title:
DEVICE FOR BONDING COIL
Document Type and Number:
Japanese Patent JPH01129407
Kind Code:
A
Abstract:
PURPOSE:To improve the accuracy of the position of bonding of a coil, and to enable bonding in a short time by a method wherein an article to be bonded, on which adhesives are applied previously, is fixed, the coil is fastened under the state in which the coil is inserted into a pin projected from a coil pressure- welding section and pushed, and a lever is turned by a pin sliding mechanism and the pin is drawn after a fixed time passes. CONSTITUTION:An article to be bonded 22 on which adhesives are applied is fixed onto a support section 12 for the article to be bonded, and coils 14a, 14b are inserted into pins 15a, 15b projected onto coil pressure-welding sections 18a, 18b. Bases 13a, 13b are moved in the horizontal direction toward the article to be bonded 11 by base sliding mechanisms 22a, 22b, and the coils 14a, 14b and the article to be bonded 11 are fastened under a pushed state. Levers 20a, 20b are turned by a pin sliding mechanism 21 and only the pins 15a, 15b are slid, and the pins are drawn from the coils 14a, 14b. The bases 13a, 13b are retreated from the article to be bonded by the base sliding mechanisms 22a, 22b, thus completing a bonding process.
Inventors:
SHIRAI OSAMU
Application Number:
JP28746187A
Publication Date:
May 22, 1989
Filing Date:
November 16, 1987
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA ELECTRONIC DEVICE ENG
TOSHIBA ELECTRONIC DEVICE ENG
International Classes:
H01F41/04; H01F41/00; H01F41/02; (IPC1-7): H01F41/02
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)