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Title:
DEVICE FOR COOLING BOILED GAS MEDIUM AND ELECTRONIC APPARATUS FOR MOUNTING ITS APPARATUS
Document Type and Number:
Japanese Patent JP2008147482
Kind Code:
A
Abstract:

To provide a device for cooling a boiled gas medium which effectively cools an object-to-be-cooled, keeping the object-to-be-cooled for a long life and an electronic apparatus for mounting its device.

The device 10 for cooling a boiled gas medium includes: a cooling container 14 in which a liquid cooling medium 12 is enclosed; a heat absorbing portion 18 which is a part of the wall surface of the cooling container, absorbs the heat produced by the object 16-to-be-cooled located on the outside of the cooling container, and transmits the heat to the liquid cooling medium 12 through the wall surface; a radiation portion 24 which is a part of inside of the cooling container and absorbs the heat to cool a boiled gas cooling medium 20 and liquefy it; a liquid cooling medium vibration means 26 which is located on the outside of the cooling container and vibrates the liquid cooling medium 12 at a predetermined vibration frequency; and a characteristic vibration frequency reducing means 28 which is located between the object-to-be-cooled 16 and liquid cooling medium vibration means 26 and reduces a characteristic vibration frequency of the object-to-be-cooled locating portion A on which the object-to-be-cooled 16 is located lower than the vibration frequency.


Inventors:
ISHIDA TOMOTAKA
YAMAMOTO MITSURU
HOJO SAKAE
Application Number:
JP2006334175A
Publication Date:
June 26, 2008
Filing Date:
December 12, 2006
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L23/427; F25D9/00; F28D15/02; H05K7/20
Attorney, Agent or Firm:
Shunichi Yoshimura