Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVICE FOR DISCHARGING DIE BONDING PASTE
Document Type and Number:
Japanese Patent JPS6362572
Kind Code:
A
Abstract:

PURPOSE: To prevent defective die bonding and to improve the working yield of paste by providing a capacitance sensor mechanism for detecting the position of the surface of the die bonding paste in a vessel on the outside of the vessel.

CONSTITUTION: A small-bore discharge port 3 is provided to the vessel 1 contg. the die bonding paste 2,and the paste 2 is compressed and discharged to the outside from the discharge port 3. The position of the surface of the paste 2 in the vessel 1 is detected by the capacitance sensor mechanism 7 provided on the outside of the vessel 1. Consequently, the paste-contg. vessel can be exchanged at an early stage with a fresh one, the lost-motion in compressing an empty paste container is eliminated, defective die bonding is prevented, and further the working yield of paste can be improved.


Inventors:
OKUNOYAMA TERU
Application Number:
JP20603486A
Publication Date:
March 18, 1988
Filing Date:
September 03, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CHEM CORP
International Classes:
B05C5/00; H01L21/52; (IPC1-7): B05C5/00; H01L21/52
Domestic Patent References:
JPS6155974B21986-11-29
JP62075878B
Attorney, Agent or Firm:
Eiji Morota