PURPOSE: To prevent defective die bonding and to improve the working yield of paste by providing a capacitance sensor mechanism for detecting the position of the surface of the die bonding paste in a vessel on the outside of the vessel.
CONSTITUTION: A small-bore discharge port 3 is provided to the vessel 1 contg. the die bonding paste 2,and the paste 2 is compressed and discharged to the outside from the discharge port 3. The position of the surface of the paste 2 in the vessel 1 is detected by the capacitance sensor mechanism 7 provided on the outside of the vessel 1. Consequently, the paste-contg. vessel can be exchanged at an early stage with a fresh one, the lost-motion in compressing an empty paste container is eliminated, defective die bonding is prevented, and further the working yield of paste can be improved.
JPS6155974B2 | 1986-11-29 | |||
JP62075878B |