Title:
DEVICE FOR ELECTROPLATING EXTERNAL LEAD OF INSULATING AND SEALING TYPE SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPS63109185
Kind Code:
A
Abstract:
PURPOSE:To improve the adhesion between a deposited plating material and a frame contact part by roughing the surface of the frame contact part when the surfaces of the frame contact parts of the upper and lower transfer rollers are formed with a metallic body. CONSTITUTION:When a film is coated on the surface of the external lead of an insulating and sealing type semiconductor package, at least one of the frame contact parts of the upper and lower rollers for rolling and transferring the frame of the insulating and sealing type semiconductor package is formed with a metallic body. The transfer roller 3 with the frame contact part 3a formed with the metallic body is dipped in the electrolytic etching soln. 8 in an electrolytic etching cell 7 along with the rotating shaft 1, the transfer roller 3 is used as an anode, a stainless steel sheet 9 is used as a cathode, and a DC current is passed for about 10min between both electrodes 3 and 9 from a power source 10. As a result, a rough surface 30a is formed on the frame contact part 3a, and the sticking of the plating material deposited on the frame contact part 3a to the frame side of the semiconductor package is prevented.
Inventors:
HIEDA SATONORI
SASAKI IKUO
YAMAMOTO KENJI
SASAKI IKUO
YAMAMOTO KENJI
Application Number:
JP25411486A
Publication Date:
May 13, 1988
Filing Date:
October 23, 1986
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/48; C25D5/02; C25D7/00; C25D7/12; H01L23/50; (IPC1-7): C25D5/02; C25D7/12; H01L23/50
Attorney, Agent or Firm:
Masuo Oiwa
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