SLITTING/ADHERING DEVICE FOR INTERLEAF FOR LITHOGRAPHIC PRINTING PLATE AND SLITTING/ADHERING METHOD

Japanese Patent JP3893555

B2

PROBLEM TO BE SOLVED: To unnecessitate a work for peeling interleaf from a web and to recover a web cutting down part cut down from a side end part of the web and a interleaf cutting down part cut down from a side end part of interleaf without coexisting.
SOLUTION: After both side end parts along a width direction of interleaf 26 are cut along a longitudinal direction by a slitter 88 of a slitting/adhering device and the interleaf 26 is made a width corresponding to the width of the web 14 after the cutting, interleaf 26 is electrostatically adhered to the surface of the web 14 by a interleaf adhering part 22. At this time, the interleaf 26 is cut so that the width may be narrow in the range of ≥0 mm and <20 mm for the width (slit width) of the web 14 after the cutting. As a result, when the web 14 is cut into the slit width, the interleaf 26 is not adhered to the web cutting down part 40 cut down from the side end part of the web 14 by a slitter device 34 and only the web cutting down part 40 can be easily recovered as aluminum scraps without performing the work for peeling the interleaf cutting down part 86.

Kazuo Horiuchi

JP2000130078A

March 14, 2007

April 28, 2000

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FUJIFILM Corporation

B65H39/16; B41N3/00; B65H35/02; B65H37/04; (IPC1-7): B65H39/16; B65H35/02; B65H37/04

JP2000108536A
JP10194584A
JP5178529A
JP2001122511A
JP2000127092A
JP2001300888A
JP2001302072A

Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda

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