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Title:
DEVICE AND METHOD FOR DETECTING SURPLUS DIES ON LEAD FRAME
Document Type and Number:
Japanese Patent JPH04208543
Kind Code:
A
Abstract:

PURPOSE: To prevent surplus dies from flowing out to the next process by detecting the existence of dies, which come on a lead frame, and setting the detection timing to the period excluding the period when the die in the normal position of the lead frame passes the detection range of a die detection sensor.

CONSTITUTION: A permeable die detection sensor 18 is installed on a guide rail 15, and this performs the detection of the die 16 on a lead frame 6. Hereupon, to make the detection area (P) for performing the die detection by the sensor 18, areas (S) and (R) for setting detection areas are installed in the operation course of a sending shaft 11. And the period when the sensor 18 detects the die 16 is set to the period excluding the period when the die to be put in the normal position of the frame 6 passes the detection range of the sensor 18, and it informs that the surplus dies 17 are detected by the sensor 18. Hereby, the trouble that the surplus dies are sent to the next mold process can be prevented without fail.


Inventors:
KODAMA MASAMI
HIJIYA TAKEHIRO
Application Number:
JP34075290A
Publication Date:
July 30, 1992
Filing Date:
November 30, 1990
Export Citation:
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Assignee:
MIYAZAKI OKI DENKI KK
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/66; H01L21/52; H01L21/67; H01L21/68; (IPC1-7): H01L21/52; H01L21/66; H01L21/68
Attorney, Agent or Firm:
Funabashi Kuninori