Title:
DEVICE FOR MOUNTING ELECTRONIC PART AND METHOD FOR MOUNTING THE SAME
Document Type and Number:
Japanese Patent JP2004103923
Kind Code:
A
Abstract:
To provide a mounting method that can cope with highly density mounting, narrow pitch mounting and mounting in a cavity.
A chip is taken out from a wafer with a pick-up nozzle and it is held thereby. At this time, a displacement quantity of the chip when compared with the reference attitude is obtained, and when the chip is actually delivered to a mounting nozzle for mounting a chip to a board, the displacement is corrected in consideration of the displacement as to allow the chip to always be held by the mounting nozzle in a fixed attitude.
Inventors:
MIZUNO TORU
ASAKURA TOMOMI
ITO MASATOSHI
KANEKO MASAAKI
MIYAKOSHI TOSHINOBU
ASAKURA TOMOMI
ITO MASATOSHI
KANEKO MASAAKI
MIYAKOSHI TOSHINOBU
Application Number:
JP2002265373A
Publication Date:
April 02, 2004
Filing Date:
September 11, 2002
Export Citation:
Assignee:
TDK CORP
International Classes:
B23P19/00; H01L21/00; H01L21/60; H05K13/04; (IPC1-7): H01L21/60; H05K13/04
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
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