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Patent Searching and Data


Title:
DEVICE FOR WRAPPING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPH0232907
Kind Code:
A
Abstract:

PURPOSE: To perform automatic and continuous wrapping and, improve the reliability of products by arranging a wafer carried by a loader mechanism from a carrier is converted into a front-tilting position; a tiling angle changing mechanism which is slides a wafer under its own weight; and a glassine bag at the falling point of the wafer.

CONSTITUTION: Wafers 10 in a carrier 1 are sent out one by one by the stepdown of the carrier, are carried by a wafer loader 9 and stop on a angle changing drum 16 of a tilting angle change mechanism 3. When a wafer 10 is detected, it is sucked onto the drum 16 surface through a vacuum hole 23. Then the angle changing drum 16 rotates forward by 60° so that the wafer stops with its front tilted and at the same time vacuum is canceled. The wafer 10 begins to drop along a rail 20 only under its own weight and reaches in a glassine bag 8. A glassine bag hold mechanism 6 moves to the right by one half to wait for the next wafer, and when the wafer has dropped completely, it further moves to the right. When it reaches a storage box, a solenoid for vacuum is unlocked to release the glassine bag 8.


Inventors:
OGURA NORIO
Application Number:
JP17224988A
Publication Date:
February 02, 1990
Filing Date:
July 11, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
B65B5/04; B65G49/07; B65H5/18; B65H5/36; B65H29/48; (IPC1-7): B65B5/04; B65H5/18; B65H5/36; B65H29/48
Attorney, Agent or Firm:
Sugano Naka