Title:
DIAMOND SAW WIRE
Document Type and Number:
Japanese Patent JP3218306
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a saw wire that is for slicing off silicon disks.
SOLUTION: The saw wire comprises a steel wire, an intermediate layer for protecting the wire against hydrogen embrittlement and ensuring a sufficient bonding strength of metallic bond phases, and a metallic bond phase including diamond grains adhering thereto, and has a cutting width below 0.3 mm and a circular cross section. This constitution causes less cutting loss for cutting expensive and brittle materials.
Inventors:
Jörg Luke Chandel
Jürgen Meyer
Jürgen Meyer
Application Number:
JP23859999A
Publication Date:
October 15, 2001
Filing Date:
August 25, 1999
Export Citation:
Assignee:
Electro-Schmelzberg Kempten Gesellschaft Mitt Beschlenktel Haftung
International Classes:
B24B27/06; B23D61/18; B28D5/00; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Domestic Patent References:
| JP91455A | ||||
| JP9150314A | ||||
| JP10151560A | ||||
| JP4164511A | ||||
| JP1117856U |
Attorney, Agent or Firm:
Toshio Yano (3 outside)