Title:
DICING DEVICE AND SETTING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3105057
Kind Code:
B2
Abstract:
PURPOSE: To shorten the time to be required for the setting operation of a grinding wheel blade (blade), and reduce the abrasion quantity of the blade during the setting operation in a dicing device and the setting method thereof.
CONSTITUTION: A dicing device provided with a rotating grinding wheel blade 1, which is obtained by fixing the grinding grains with the binder, and a cutting liquid supply means 2 for supplying the cutting liquid to the contact part of the grinding wheel blade 1 and the material 10 to be processed. The dicing device is also provided with an accelerator supply means 3 for supplying the accelerator, which accelerates the melt of the binder of the grinding wheel blade 1, in the cutting liquid and an accelerator supply control means 4 for controlling the accelerator supply means 3 so that the accelerator is supplied at the only time of processing a dummy member as the material 10 to be processed to bring the surface condition of the grinding wheel blade 1 appropriate for the processing.
Inventors:
Mitsuo Sorimachi
Jiro Tsuchishima
Kazuhiro Yotsuji
Jiro Tsuchishima
Kazuhiro Yotsuji
Application Number:
JP3334092A
Publication Date:
October 30, 2000
Filing Date:
February 20, 1992
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
Asahi Diamond Industry Co., Ltd.
Asahi Diamond Industry Co., Ltd.
International Classes:
B24B27/06; B24B53/00; B28D5/00; B28D7/02; H01L21/301; H01L21/78; (IPC1-7): B24B53/00; B24B27/06; H01L21/301
Domestic Patent References:
| JP62123738A | ||||
| JP6427859A | ||||
| JP60127970A |
Attorney, Agent or Firm:
Aoki Akira (4 outside)