To provide a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a workpiece and detachability upon the integral detachment of a chip-type workpiece produced by the dicing together with the die-bonding film even when the workpiece is thin.
The dicing die-bonding film comprises a dicing film having an adhesive layer on a base material, and a die-bonding film arranged on the dicing film, wherein the adhesive layer comprises: a polymer which is produced by the addition reaction of 10 to 30 mol% of an acrylic polymer containing a hydroxyl-containing monomer in an amount of 70 to 90 mol% based on the hydroxyl-containing monomer of an isocyanate compound having a radical-reactive carbon-carbon double bond; and a crosslinking agent which has two or more functional groups each reactive to a hydroxyl group in its molecule and which is contained in an amount of 2 to 20 pts.wt. based on 100 pts.wt. of the polymer, and wherein the die-bonding film comprises an epoxy resin.
KAMIYA KATSUHIKO
MURATA SHUHEI
| JP2005005355A | 2005-01-06 | |||
| JP2007277282A | 2007-10-25 | |||
| JP2004022784A | 2004-01-22 | |||
| JP2009135378A | 2009-06-18 |
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