Title:
DICING PRESSURE-SENSITIVE ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2001152106
Kind Code:
A
Abstract:
To prepare a dicing pressure-sensitive adhesive film which can be uniformly expanded and prevent the destruction of chips due to static electricity on picking up the chips in the die bonding step after having diced a semiconductor wafer and can be incinerated after use.
This dicing pressure-sensitive adhesive film has a coefficient of static friction against a stainless steel sheet of ≤0.3 and is obtained by forming an antistatic layer and a pressure-sensitive layer in this order on the back of a film substrate having a tensile modulus of 50-200 MPa.
Inventors:
SHIMANE MICHIHIRO
YAMAMOTO OSAMU
YAMAMOTO OSAMU
Application Number:
JP33221699A
Publication Date:
June 05, 2001
Filing Date:
November 24, 1999
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B27/00; B32B27/32; C09J7/02; C09J133/00; C09J201/00; C09K3/16; H01L21/301; (IPC1-7): C09J7/02; B32B27/00; C09K3/16; H01L21/301
Attorney, Agent or Firm:
Kunihiko Wakabayashi