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Patent Searching and Data


Title:
DIE BONDING APPARATUS AND ITS CONTROL METHOD
Document Type and Number:
Japanese Patent JPH04133337
Kind Code:
A
Abstract:

PURPOSE: To land a die on a die pad in parallel and to exert a load vertically by controlling the following simultaneously: the servomotor of a Z-axis direction driving mechanism; and a linear motor which gives a torque on a second arm of a die-bonding arm mechanism.

CONSTITUTION: The servomotor 53 of a Z-axis direction driving mechanism 50 is driven; a bonding arm mechanism 60 starts lowering. Its lowering motion is always monitored by using an analog photosensor 80 and is fed back to a microcomputer 161. When it is detected that an arm 62 is displaced from the parallel state by a prescribed value or higher, the mechanism 60 is raised. When its displacement cannot be detected by using the sensor 80, its raising motion is stopped. Then, a die 20 is landed on a die pad 31 in parallel. Then, the arm mechanism 60 starts lowering again. When the parallel state of the arm 62 is displaced by a second prescribed value or higher, its lowering motion is stopped. The value of a coil current to a linear motor 90 is increased; the arm 62 tends to return to the parallel state while exerting a load on the die 20. When the arm 62 is not displaced and the coil current has reached a prescribed value, a load control operation is stopped.


Inventors:
YOSHIDA MASAHARU
YAMAMOTO AKIRA
BANJO TOSHINOBU
Application Number:
JP25411190A
Publication Date:
May 07, 1992
Filing Date:
September 26, 1990
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/52; H01L21/00; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Mitsuteru Soga (5 people outside)