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Title:
DIE BONDING DEVICE
Document Type and Number:
Japanese Patent JPH05198604
Kind Code:
A
Abstract:

PURPOSE: To facilitate the control, reduce the production cost of a device and improve the versatility by reducing the control means for shifting and positioning.

CONSTITUTION: A first nut 35 is provided with a lead frame sucking part 33 which sucks a lead frame 32 stored in a lead frame storing part 31 to take out the lead frame and a paste coating means 34 which coats the lead frame 32 with paste. A first ball screw 36 is screwed into the first nut 35. A second ball screw 38 is screwed into a second nut provided with the ball screw 36. The first and second ball screws 36 and 38, the lead frame sucking part 33 and the paste coating means 34 are digital by controlled by a control part. Therefore, the control is facilitated, the production cost of the device is reduced and the versatility is improved.


Inventors:
YAMAZAKI MITSUHARU
KOBAYASHI HIROAKI
Application Number:
JP918192A
Publication Date:
August 06, 1993
Filing Date:
January 22, 1992
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Takehiko Suzue



 
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