To provide a die bonding device which can prevent the occurrence of off-specification products and the faults of manufactured semiconductor devices.

Before bonding a chip, the image of a lead frame to which solder is supplied is taken (S3) and the picture is processed (S4), and then the area S of the solder is acquired (S5). Then, whether or not the acquired area S meets a predetermined condition is checked (S6) and, when the area S meets the condition, the value N of a counter is initialized (S7) and the chip is bonded. When the area S does not meet the condition, the value N is updated by decrementing the value N (S9) and, when the value N is not '0', the lead frame is sent to the next transporting work by skipping the bonding work. When the value N becomes '0' ('no' in S10), the abnormality is reported (S11) and all operations are stopped (S12). Therefore, a work which is bonded in an undersirable state is prevented from being sent to the next process.