Title:
DIE POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH08168949
Kind Code:
A
Abstract:
PURPOSE: To provide a die polishing device which can polish a die while greatly reducing unpolished areas.
CONSTITUTION: A workpiece is supported on a rotatable table 1, and a polishing tool 8e is supported with an X-axis member 2x, a Y-axis member 2y, a Z-axis member 2z and a tool support member 8 capable of rotating within a vertical plane, and is put into linear motion so as to perform polishing by means of device motion.
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Inventors:
IGA TAKUMI
YAMAMOTO SEIGO
IWAKAME MAKOTO
KAWADA KENICHI
YAMASHITA MASANORI
SAWADA YUZO
YAMAMOTO SEIGO
IWAKAME MAKOTO
KAWADA KENICHI
YAMASHITA MASANORI
SAWADA YUZO
Application Number:
JP33439094A
Publication Date:
July 02, 1996
Filing Date:
December 18, 1994
Export Citation:
Assignee:
DAIKIN IND LTD
International Classes:
B23Q15/00; B24B19/00; B24B49/10; G05B19/42; (IPC1-7): B24B19/00; B23Q15/00; B24B49/10; G05B19/42
Attorney, Agent or Firm:
Tsugawa friend
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