Title:
DIE FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPS5922334
Kind Code:
A
Abstract:
PURPOSE:To facilitate control of volume of solder, etc., to facilitate positioning of the semiconductor ship and to improve workability by a method wherein the die for the semiconductor chip provided with protrusions to support the circumference of the semiconductor chip in the mounting part of the semiconductor chip formed at a concave part is used. CONSTITUTION:A radiator plate 5 is provided at one side part of the mounting part 2 formed at the recessed part of the chip die for the semiconductor, terminals 6 are provided at another side part, and the protrusions 3 to support the circumference of the semiconductor chip 1 are provided at the circumference inside of the mounting part 2. A flux is applied to the lower face in the mounting part 2 at first, and preforming solder or cream type solder is put on the center. After the semiconductor chip 1 is put on solder 6 thereof, and the die is put on a conveyer and passed through a heating furnace in this condition, when it is cooled, the semiconductor chip 1 is fixed to the mounting part 2. Because the semiconductor chip 1 floating on molten solder is supported at the circumference thereof by the protrusions 3, it is held in the positioned condition till solder is solidified. Moreover melting and flowing solder installs itself between the protrusions 3 at the outside circumference of the mounting part 2 consisting of the recessed part.
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Inventors:
TAKAMI SHIGENARI
IRIE TATSUHIKO
IRIE TATSUHIKO
Application Number:
JP13235482A
Publication Date:
February 04, 1984
Filing Date:
July 28, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L21/52; H01L21/58; H01L23/48; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Toshimaru Takemoto