Title:
DIELECTRIC PASTE, AND MANUFACTURE OF THICK FILM MULTI-LAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP3399317
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide dielectric paste which can be baked in nitrogen and is excellent in insulation characteristics after baking, and a manufacturing method of a thick film multi-layer substrate excellent in insulation characteristics using the same.
SOLUTION: A Cu-based conductor 2 is disposed on a ceramic substrate 1. Dielectric paste is printed on the ceramic substrate 1. The dielectric paste comprises glass powder, an insulation acceleration substance, and a resin containing at least ethyl cellulose dispersed in organic solvent, and 0.1-5.0 wt.% of PrO2 is added. It is then baked in a nitrogen atmosphere to provide a dielectric layer 3. PrO2 is heat-decomposed to become Pr2O3 in a temperature range of 300-600°C while emitting oxygen when it is baked, and decomposition of ethyl cellulose is accelerated by this released oxygen to be roughly completely decomposed in the temperature range of 300-600°C to disappear.
Inventors:
Rikiya Uemura
Masahiro Sone
Yoshiyuki Miyase
Toru Nomura
Nobuyuki Sugishita
Kousuke Toyama
Masahiro Sone
Yoshiyuki Miyase
Toru Nomura
Nobuyuki Sugishita
Kousuke Toyama
Application Number:
JP27451397A
Publication Date:
April 21, 2003
Filing Date:
October 07, 1997
Export Citation:
Assignee:
株式会社デンソー
International Classes:
C03C8/10; H01B3/00; H01B3/02; H05K3/46; (IPC1-7): H01B3/00; C03C8/10; H01B3/02; H05K3/46
Domestic Patent References:
| JP628404A | ||||
| JP61220203A | ||||
| JP59137343A |
Attorney, Agent or Firm:
Hironobu Onda