Title:
建物部品の無線周波数信号透過率を改善するための誘電体構造及びその設置方法
Document Type and Number:
Japanese Patent JP7176117
Kind Code:
B2
Abstract:
A dielectric structure (200A,200B,200C,200D,300A,300B,300C,300D) applied to building components for increasing a transmittance of an RF signal is provided. The dielectric structure (200A,200B,200C,200D,300A,300B,300C,300D) includes a structural body (403) and a fixing component (220,330,402). The structural body (403) includes at least one dielectric material layer (201,202,301), and a dielectric constant of each dielectric material layer (201,202,301) is between 1 and 10,000. The fixing component (220,330,402) joins the structural body (403) and a joining component (250,350,401). A composite structure after the dielectric structure (200A,200B,200C,200D,300A,300B,300C,300D) and building components are joined may have the RF signal of the working frequency f0 pass and reduce the reflection loss. The minimum equivalent diameter of a projection plane on a surface of the joining component (250,350,401) of the dielectric structure (200A,200B,200C,200D,300A,300B,300C,300D) on a surface through which an RF signal passes is no less than one-eighth of a working wavelength λ0 corresponding to the working frequency f0.
Inventors:
Sign
Roh Ming
Wu Nitto
Roh Ming
Wu Nitto
Application Number:
JP2021531362A
Publication Date:
November 21, 2022
Filing Date:
November 10, 2020
Export Citation:
Assignee:
Sign
International Classes:
H01Q15/14
Domestic Patent References:
| JP2018191281A | ||||
| JP5085774A | ||||
| JP2003229712A | ||||
| JP2004502978A |
Foreign References:
| CN102969566A | ||||
| US20040075923 |
Attorney, Agent or Firm:
Takao Koshikawa