Title:
DIELECTRIC SUBSTRATE WITH SELECTIVELY CONTROLLED EFFECTIVE PERMITTIVITY AND LOSS TANGENT
Document Type and Number:
Japanese Patent JP3920279
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To allow a selected portion of a substrate to particularly have desired dielectric characteristics by providing remarkable flexibility for an RF designer and basically selecting a dielectric thickness without requiring a change that requires costs, the flexibility of said approach giving control to the RF designer without changing working steps and approximately without restricting an effective permittivity and a loss tangent.
SOLUTION: A substrate (300) for an RF device includes a plurality of layers (102) of dielectric materials cofired in a stack. The plurality of layers (102) are formed of materials having permittivities. Selected one of the layers (102) has a pattern of perforation (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).
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Inventors:
Dennis El Teve
Thomas Peas Smith
William Johnson Chapel
Thomas Peas Smith
William Johnson Chapel
Application Number:
JP2004157827A
Publication Date:
May 30, 2007
Filing Date:
May 27, 2004
Export Citation:
Assignee:
Harris Corporation
International Classes:
H04B1/38; H01Q1/38; H01Q15/00; H05K1/02; H05K1/03; H05K3/46; (IPC1-7): H04B1/38
Domestic Patent References:
| JP2001358415A | ||||
| JP2002171119A |
Foreign References:
| WO1995030917A1 | ||||
| WO1992015124A1 | ||||
| WO1994013029A1 | ||||
| US6307509 |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito
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