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Title:
DIFFUSION BONDING METHOD
Document Type and Number:
Japanese Patent JP2010094712
Kind Code:
A
Abstract:

To provide a diffusion bonding method by which sufficient bonding strength can be obtained and the deformation of the body to be bonded after diffusion bonding is reduced.

In the diffusion bonding method where the body 1 to be bonded is pressurized only to the lamination direction of the body 1 to be bonded by a pressurizing apparatus, a metal plate 3 (3a to 3n) is arranged in a state of being provided with a prescribed gap with the outer wall face 5 of the laminated body 1 to be bonded so as to surround the whole of the outer wall face 5 of the body 1 to be bonded, only the body 1 to be bonded is pressurized to the lamination direction of the body 1 to be bonded by the pressurizing apparatus, and the body 1 to be bonded is bonded while restricting the deformation of the body 1 to be bonded to a direction orthogonal to the pressurizing direction.


Inventors:
YAMAZAKI HISAO
YAMAZAKI TAKUYA
Application Number:
JP2008267830A
Publication Date:
April 30, 2010
Filing Date:
October 16, 2008
Export Citation:
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Assignee:
SEKISOU KANAGATA CO LTD
International Classes:
B23K20/00
Domestic Patent References:
JPS57134284A1982-08-19
JPS58112680A1983-07-05
JPH09225655A1997-09-02
Attorney, Agent or Firm:
Hiroshi Sentokuin