To provide a dip coating apparatus that enables a uniform coating of both sides of a discoid substrate by preventing a liquid puddle at the lower part of the discoid substrate.

The apparatus comprises a substrate-holding mechanism 110 equipped with a substrate holding part 112 for holding the discoid substrate D, a dipping vessel 120 for containing a coating liquid L and a lifting mechanism for relatively lifting the substrate-holding mechanism 110 and the dipping vessel 120. The substrate-holding mechanism 110 is equipped with a wire gauzy liquid-puddle preventing part 114 which is installed below the lower end of the discoid substrate D with a predetermined clearance.