PURPOSE: To obtain a copper alloy wire having plural layers at a low cost by segmenting the inside of a crucible to a seed wire supply chamber and alloy element adding chamber communicating with each other, using the seed wire on the surface of which a molten metal is stuck again as the seed wire and sticking repeatedly the molten metal thereto.
CONSTITUTION: The molten copper A obtd. in a melting furnace 11 is supplied into the alloy element adding chamber 10c in the crucible 10. Tin, etc. are added into the chamber 10 to form a molten copper alloy B. The alloy B flow through a communicating hole 10d at the bottom end of a partition wall 10A to a seed wire traveling chamber 10B. The 1st seed wire 14 made of pure copper travels upward and continuously in the chamber 10B and the molten alloy B sticks to the surface of the wire 14 in the stage when said wire is pulled up. The 1st copper alloy layer 15 is thus formed. Such wire is used as the 2nd seed wire 16 and the 3rd seed wire having the 2nd copper alloy layer is formed on the outside of the wire 16 by using the same apparatus as the above- mentioned apparatus after rolling. Such dip forming operation is repeated ≥3 times to obtain multiple kinds of the copper alloy wires.
TOMINAGA HARUO
YAMAGUCHI TETSUO
| JP57097670B | ||||
| JPS5797862A | 1982-06-17 | |||
| JPS5487661A | 1979-07-12 |