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Title:
DIP FORMING METHOD
Document Type and Number:
Japanese Patent JPS63286266
Kind Code:
A
Abstract:

PURPOSE: To form complexed electric conductive wire rod having uniform alloy concn. and only a little segregation in copper alloy layer at outer circumferential part by using pre-melting material in the other melting furnace as alloy element additional material or base alloy added in molten copper in a crucible.

CONSTITUTION: In a refractory crucible 2, a inserting hole 1 for seed wire 15 at bottom part, a supplying hole 4 for molten copper at side wall and an additional hole 24 supplying molten metal 23 for the additional alloy element or the base alloy into the crucible 2 at wall part of refractory for heat shielding communicated further at upper part, are respectively formed. This additional hole 24 is connected with the tapping hole 26 of the other melting furnace 25 and the molten additional alloy element or the molten base alloy 23 melted in this melting furnace 25 is added into the molten copper in the crucible 2 through a tube 27 at flowing rate corresponding to supplying rate of the wire rod 29 to produce the molten metal 30 of copper alloy having the fixed concn. Then, the molten metal 30 is stuck and solidified around the seed wire 15 accompanied with continuous drawing-up and the copper alloy layer having uniform concn. is formed around the seed wire 15.


Inventors:
TOMINAGA HARUO
TAKAYAMA TERUYUKI
KUROSAKA AKITO
Application Number:
JP11948987A
Publication Date:
November 22, 1988
Filing Date:
May 16, 1987
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
B22D23/04; (IPC1-7): B22D23/04
Domestic Patent References:
JPS6132110A1986-02-14
JPS61115655A1986-06-03
Attorney, Agent or Firm:
Takehisa Toyota