Title:
DIRECT CHIP STICKING BY ELECTRICAL CONDUCTIVITY BONDING AGENT
Document Type and Number:
Japanese Patent JPH07231011
Kind Code:
A
Abstract:
PURPOSE: To obtain an intermediate wafer product by a method, wherein bumps made of conductive thermoplastic adhesive are stuck to the metal pads of a wafer which has a matrix of the conductive metal pads and the surroundings of the conductive bumps are filled with insulating thermoplastic adhesive. CONSTITUTION: Bumps 4 made of conductive thermoplastic adhesive are stuck to the conductive metal pads 8 of a wafer 1, which has the matrix of the conductive metal pads 8 by mask screening and the conductive thermoplastic adhesive is dried. Then, an insulating thermoplastic adhesive 2 is applied to the interstices of the conductive thermoplastic bumps 4 of the wafer 1 to form a composite structure 5 covering the entire surface of the wafer 1. The wafer 1 is baked so as to dry the insulating thermoplastic adhesive 2 and an intermediate wafer product. With this constitution, the regions other than the conductive metal pads are filled with the insulating thermoplastic adhesive, and the mechanical strength of the chip connection is improved.
Inventors:
RICHIYAADO BII BUUSU
MAIKERU EI GAINESU
ROBAATO EMU MARUKO
BISUWANADAMU PARIGANDERA
JIYUDESU EMU RORUDAN
RABI SARAFU
JIYAAJII EMU ZARESHINSUKII
MAIKERU EI GAINESU
ROBAATO EMU MARUKO
BISUWANADAMU PARIGANDERA
JIYUDESU EMU RORUDAN
RABI SARAFU
JIYAAJII EMU ZARESHINSUKII
Application Number:
JP32450194A
Publication Date:
August 29, 1995
Filing Date:
December 27, 1994
Export Citation:
Assignee:
IBM
International Classes:
H01L21/56; H01L21/60; H01L23/485; H01R4/04; (IPC1-7): H01L21/60; H01R4/04
Domestic Patent References:
| JPH01226161A | 1989-09-08 | |||
| JPH0442550A | 1992-02-13 | |||
| JPH04234139A | 1992-08-21 | |||
| JPH03209840A | 1991-09-12 |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)