To provide a dividing method of a wafer with which an alteration layer is formed, by irradiating the inside of the wafer with a laser beam, along a line scheduled to be divided, and the wafer can be efficiently divided along the alteration layer.
The work method of the wafer, for dividing the wafer along the prescribed line scheduled to be divided, includes an alteration layer forming process for irradiating the wafer with the pulse laser beam having transparency along the line scheduled to be divided, and forming the alteration layer in the wafer along the line scheduled to be divided; and a division process for making sound wave act on the wafer, where the alteration layer is formed along the line scheduled to be divided, and dividing the wafer along the line scheduled to be divided.
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NAKAMURA MASARU
KOBAYASHI MASASHI
MORISHIGE YUKIO
Sachiko Okunuki