Title:
DIVISION METHOD OF CHIP COMPONENT
Document Type and Number:
Japanese Patent JP2020053656
Kind Code:
A
Abstract:
To provide a division method of a chip component, capable of stably dicing a sheet-like substrate to a minimum size chip unit.SOLUTION: A functional element such as an upper surface electrode 2 or a resistor 3 or the like is formed on an upper surface of a sheet-like substrate 10, and thereafter, a wax 12 is applied to at least one of opposite surfaces of a support stage 11 made of a porous ceramic of this sheet-like substrate 10. Sequentially, by crimping the sheet-like substrate 10 to the upper surface of the support stage 11 while softening the wax 12, bubbles entered into between the sheet-like substrate 10 and the support stage 11 escape to an external part passing through the support stage 11 made of the porous ceramic. After that, the sheet-like substrate 10 is bonded and fixed to the upper surface of the support stage 11 by hardening the wax 12, and the sheet-like substrate 10 is made into many chip units by performing dicing for a primary division and secondary division to the sheet-like substrate 10 in this state.SELECTED DRAWING: Figure 3
Inventors:
MATSUMOTO KENTARO
Application Number:
JP2018184691A
Publication Date:
April 02, 2020
Filing Date:
September 28, 2018
Export Citation:
Assignee:
KOA CORP
International Classes:
H01L21/301; H01G13/00
Domestic Patent References:
| JP2002025947A | 2002-01-25 | |||
| JP2015131878A | 2015-07-23 | |||
| JPH10270533A | 1998-10-09 | |||
| JP2008062374A | 2008-03-21 |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office