Title:
DOUBLE FACE POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3684983
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a double face polishing device capable of suppressing the abrasive sagging in the outer circumferential surface of a semiconductor wafer and enhancing the flatness of the wafer.
SOLUTION: A carrier plate 11 is moved within the plane parallel to the plate surface between upper and lower surface plates 12 and 13 while supplying a slurry to a silicon wafer W. The double faces of the wafer W are polished by soft nonwoven fabric pads 12 and 13. At this time, the wafer W is rotated and polished while partially protruding the wafer outer circumferential part out of both the pads 12 and 13. The wafer outer circumferential part is passed in the non-abrasive area every prescribed angle rotation and polished. Consequently, the contact area per unit time to both the pad 12 and 13 in the wafer outer circumferential part is reduced, compared with the wafer central part, and the abrasive sagging in the wafer outer circumferential part can be suppressed, and the flatness can be also enhanced.
Inventors:
Haruji Harada
Application Number:
JP2000054803A
Publication Date:
August 17, 2005
Filing Date:
February 29, 2000
Export Citation:
Assignee:
Mitsubishi Sumitomo Silicon Co., Ltd.
International Classes:
B24B37/00; B24B37/08; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP11254302A | ||||
| JP1268032A | ||||
| JP11233462A |
Attorney, Agent or Firm:
Ichiro Abe