PURPOSE: To make a material cost and a processing cost inexpensive, to prevent continuity failure and disconnection by preventing through-hole plating from cracking and to prevent reliability of solder junction from lowering by preventing generation of a blow-hole.
CONSTITUTION: A paper base phenolic resin lamination board is used as a substrate 1. Through-hole plating 3 is applied to a through-hole 2, a through-hole land 4 is provided in an opening part of an upper surface and a lower surface thereof and solder resist 5 is applied from the through-hole land 4 to the through-hole plating 3 of an opening inner circumferential edge. The through- hole plating 3 is applied to a through-hole 6 and the through-hole land 4 is provided in only an opening part of a lower surface. A terminal part 7 of a mounting part is inserted to the through-hole 6 and it is charged with solder 8, and then packaging is performed. A through-hole 9 by punching processing is provided in the substrate 1, the through-hole land 4 is provided in an opening part of a lower surface of the through-hole 9. While the terminal part 7 of a mounting part is inserted to the through-hole 9, solder 8 is put in an inner circumference of the through-hole land 4, and a mounting part is packaged.
MATSUDA YOSHINARI
KAYABA MASAO
SONY CORP