Title:
DOUBLE-SIDED POLISHING DEVICE AND POLISHING CLOTH DRESSING METHOD
Document Type and Number:
Japanese Patent JP2022129701
Kind Code:
A
Abstract:
To provide a double-side polishing device capable of dressing the entire polishing cloth with a uniform load by dressing using a conditioning head, and a dressing method capable of dressing the entire polishing cloth with a uniform load by dressing using the conditioning head.SOLUTION: In a device for polishing both sides of a semiconductor wafer using a polishing cloth and a polishing slurry, an arm for supplying high-pressure washing water is accompanied by a dressing device having upper and lower conditioning heads for dressing the polishing cloth, and the dressing device has a pressure adjustment mechanism capable of pressurizing the upper and lower conditioning heads with independent pressures.SELECTED DRAWING: Figure 3
Inventors:
SASAKI TAKUYA
Application Number:
JP2021028483A
Publication Date:
September 06, 2022
Filing Date:
February 25, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
H01L21/304; B24B37/08; B24B53/017
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi
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