Title:
DRESSING METHOD FOR ABRASIVE AND ITS DEVICE
Document Type and Number:
Japanese Patent JP3214467
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dressing method for a polishing device and the device capable of constantly holding a surface state of an abrasive constant and accordingly improving uniformity, stability and controllability of polishing speed to polish a polishing material such as a wafer, etc.
SOLUTION: A dresser 7 to support a grinding plate 6 by directing its surface downward is arranged above a polishing table 1, and a rotating motor 12 capable of adjusting pressurizing force to pressurize the dresser 7 vertically downward through a torque measuring instrument 8 is installed in the center of the back surface side of the dresser 7. Additionally, the rotating motor 12 and the torque measuring instrument 8 are connected to a control part 9 connected to a rotating motor 11 of a polishing device, and the control part 9 sets a position of the grinding plate 6 on the polishing table 1 in accordance with a measuring result measured by the torque measuring instrument 8 and sets pressurizing force of the grinding plate 6 to the polishing table 1.
Inventors:
Kamochi Masaaki
Application Number:
JP31463098A
Publication Date:
October 02, 2001
Filing Date:
November 05, 1998
Export Citation:
Assignee:
NEC
International Classes:
B24B53/08; B24B53/00; (IPC1-7): B24B53/00
Domestic Patent References:
| JP6170728A | ||||
| JP6312365A | ||||
| JP6179167A |
Attorney, Agent or Firm:
Masanori Fujimaki
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