Title:
DRILL
Document Type and Number:
Japanese Patent JP3032863
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To maintain stable cutting quality and precision for the drill machining of a special hardly-cut material by applying thinning to the chisel section of a diamond-covered cemented carbide drill, forming a curvature at a corner section, and providing a negative land on a cutting edge.
SOLUTION: A tungsten carbide base cemented carbide drill is used as a base material, and a diamond film is covered and formed by the vapor phase synthetic method, and the film is formed by the thermal filament CVD method. For the film forming condition, a thermal filament is kept at about 2000°C, a drill substrate is kept at 900°C, the film is formed for 30 hr in the environment of the gas composition of H2-1 vol.% CH2 at the pressure of 100 Torr, and the film thickness is set to 10 μm. Thinning is applied to the chisel section of this diamond-covered drill, a curvature is applied to a corner section, and a negative land is provided on a cutting edge. Stable cutting quality and precision can be maintained for the drill machining of a special hardly-cut material such as a high-silicon aluminum.
Inventors:
Makoto Kawanishi
Takeshi Yoshimoto
Takeshi Yoshimoto
Application Number:
JP21640298A
Publication Date:
April 17, 2000
Filing Date:
June 16, 1998
Export Citation:
Assignee:
Osaka Diamond Industry Co., Ltd.
International Classes:
B23B51/00; (IPC1-7): B23B51/00
Domestic Patent References:
| JP2311211A |