To realize a chassis structure for IC module with a high heat radiation effect or a flat plate type display device with a high heat radiation efficiency in a driver IC mounting module and an equilibrium flat plate type display device into which the same is assembled.
To electrically connect a driver IC chip 10 for driving display electrodes of a flat plate type display panel with a substrate 11 for mounting the driver IC chip 10 thereon, at least output pads 10a of the above-mentioned driver IC chip 10 with the display electrodes, a flexible substrate 12 having output wiring formed by arranging connection terminals on one end and output terminals on the other end, the output pads 10a of the driver IC chip 10, and the connection terminals of the flexible substrate 12 are directly connected with each other. Further, the chassis is structured so that the exposed face of the output terminals on the flexible substrate 12 to be connected with the display electrodes and the mounting face of the driver IC chip 10 on the substrate 11 are formed to be opposed in the direction.
AOKI MASAMI
MATSUMOTO TOMOO
IWAI MORIMITSU
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| JPH0637421A | 1994-02-10 | |||
| JPH0511183U | 1993-02-12 | |||
| JPH03132691A | 1991-06-06 | |||
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| JPH0845986A | 1996-02-16 |