Title:
ＥＢＧ構造体および半導体装置
Document Type and Number:
Japanese Patent JP5701806
Kind Code:
B2
Abstract:
An EBG structure according to an embodiment includes an electrode unit made of a first conductor and provided with a space, a patch unit provided approximately parallel to the electrode unit and made of a second conductor, an insulating layer provided between the electrode unit and the patch unit, a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit, and a second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit.
Inventors:
Tadahiro Sasaki
Kazuhiko Itaya
Hiroshi Yamada
Kazuhiko Itaya
Hiroshi Yamada
Application Number:
JP2012075519A
Publication Date:
April 15, 2015
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01P3/08; H01L23/12; H01L25/04; H01L25/18; H01Q15/14
Domestic Patent References:
| JP2010016554A | ||||
| JP2009224567A | ||||
| JP2011258910A | ||||
| JP2004022587A | ||||
| JP2009218966A | ||||
| JP2005538629A | ||||
| JP2011249862A |
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama
Akira Sudo
Mitsuyuki Matsuyama