Title:
EBG STRUCTURE
Document Type and Number:
Japanese Patent JP2014233053
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an EBG structure capable of largely reducing an operating frequency.SOLUTION: The EBG structure includes: a ground substrate; a first dielectric layer laminated on the ground sub; a first conductor pattern laminated on the first dielectric layer and including an outer end and an inner end, the outer end being electrically connected to the ground substrate; a second dielectric layer laminated on the first conductor pattern; and a second conductor pattern laminated on the second dielectric layer and including a center part and an outer end, the center end being electrically connected to the inner end of the first conductor pattern.
Inventors:
UEDA TETSUYA
HATANAKA TAKEZO
HATANAKA TAKEZO
Application Number:
JP2013114226A
Publication Date:
December 11, 2014
Filing Date:
May 30, 2013
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01Q15/14
Domestic Patent References:
| JP2009004791A | 2009-01-08 |
Attorney, Agent or Firm:
Noboru Fujimoto
Hiroaki Nakatani
Hiroaki Nakatani
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