Title:
ELECTRIC-CIRCUIT DEVICE SEALING STRUCTURE
Document Type and Number:
Japanese Patent JP3127812
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To maintain excellent the silicon-gel sealed state of an electric circuit portion.
SOLUTION: An ignitor 13 is placed in a circuit containing space 23 formed with a partition wall 24 in a seal container 16. The ignitor 13 has a circuit board 26 on which various circuit elements 27a constituting an ignition circuit 27 are packaged. The circuit board 26 is attached to the inner bottom surface of a metal circuit container 25 which is vacuum-filled with silicon gel 30. The interface of the silicon gel 30 is in close contact with a protective sheet 31 by utilizing adhesion of the gel. The protective sheet 31 is opposed to the partition wall 24. The protective sheet 31 comprises an aramid paper, for example, which the silicon gel 30 can easily adhere to, and which easily contains gaseous material (air) and is flexible. When vacuum-filling the seal container 16 with insulating resin 19, a part of the insulating resin 19 flows to the ignitor 13 side from the opening of the partition wall 24. At this time, the protective sheet 31 protects the interface of the silicon gel 30.
Inventors:
Koji Ando
Application Number:
JP34041795A
Publication Date:
January 29, 2001
Filing Date:
December 27, 1995
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/28; F02P3/02; F02P11/00; F02P15/00; H01L23/24; (IPC1-7): H01L23/24; F02P15/00; H01L23/28
Domestic Patent References:
| JP590448A | ||||
| JP550743U | ||||
| JP627939Y2 |
Attorney, Agent or Firm:
Muneo Kako