To obtain electric and electronic parts excellent in durability by protecting electric and electronic members such as IC, transistor and diode mounted on substrates of a ceramic, epoxy resin, phenolic resin or the like with a protective film.
The electric and electronic parts excellent in durability and reliability are obtained by protection with an olefin-base low elastic modulus resin coating having 0.1-500 MPa elastic modulus at -40°C. When a specified metathesis polymerization catalyst is used in the formation of the olefin-base low elastic modulus resin coating, since the resulting resin is hardly affected by oxygen and moisture in air, a coating forming method by dipping used so far in the case of a solvent-containing acrylic resin or silicone resin can be used.
YAMAZAKI HITOSHI
KAWAI HIROMASA
INOUE YOSHIKI