Title:
電気又は電子部品及びその製造方法
Document Type and Number:
Japanese Patent JP2005505936
Kind Code:
A
Abstract:
To refine an electrical or electronic component having at least one discrete or integrated device formed from a wafer, in plate or disk form, of semiconductive or insulating material, the front face of which device has at least one protruding electrode and is encapsulated by at least one front-face encapsulant, the side faces of which device are at least partly encapsulated by at least one side-face encapsulant, and the rear face of which device is encapsulated by at least one rear-face encapsulant, and to refine a method of producing the same, in such a way that, with the aim of widening the possible uses and applications, electrical contact is made not solely with the front face of the device that is to be housed in the plastics package of very small dimensions, it is proposed that both the side-face encapsulant and the rear-face encapsulant be formed at least partly of layers, but with the layers connected, of electrically conductive material.
Inventors:
Michael, Desha
Application Number:
JP2003535252A
Publication Date:
February 24, 2005
Filing Date:
October 09, 2002
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L23/12; H01L21/56; H01L23/31; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi