Title:
ELECTRICALLY CONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JPS6422979
Kind Code:
A
Abstract:
PURPOSE: To obtain the titled adhesive for bonding electronic parts to the input units of OA equipment, between the substrates for display, etc., by incorporating an epoxy prepolymer of specified epoxy equivalent with specified amount of 12-aminododecanoic acid as the curing agent and an electrically conductive substance.
CONSTITUTION: The objective adhesive can be obtained by incorporating (A) 100pts.wt. of an epoxy prepolymer of epoxy equivalent of 160W250 with (B) 5W40pts.wt. of 12-aminododecanoic acid as the curing agent and (C) an electrically conductive substance (e.g. flaky silver powder).
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Inventors:
NAKANISHI AKIRA
Application Number:
JP17945387A
Publication Date:
January 25, 1989
Filing Date:
July 17, 1987
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01B1/20; C09J163/00; H05K3/32; (IPC1-7): C09J3/16; H01B1/20
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)