PURPOSE: To obtain a cooling device having improved heat dissipating properties at a lower cost by providing a heat pipe used for cooling semiconductor elements or electronic equipments, consisting of a structure in which a plurality of evaporation sections are connected with a plurality of condensing sections through a single electric insulator.

CONSTITUTION: A plurality of bores having predetermined inner diameter, depth and pitch are formed in a copper block 3 to provide evaporation sections 1. To these evaporation sections 1, there are connected condenser tubular bodies 5 consisting of copper tubes having a similar size to that of the evaporation sections 1. Multistage fins 2 are attached to the tubular bodies 5 in common. Between the condenser tubular bodies 5 and the copper block 3, there is provided an alumina insulator 8 by soldering the same by means of intermediate bodies 6, 6' of a sealing material, Fe-Ni alloy while the insulator 8 is passed through the condenser tubular bodies 5. Fluorocarbon is injected into the tubular bodies 5 through nozzles 9 and the tubular bodies 5 are sealed off. Cooling devices thus obtained are used in pair so that an object to be cooled such as a semiconductor element or the like is interposed therebetween. Though, the evaporation sections 1 have a similar size to that of the condenser tubular sections 5 in the embodiment as described above, they may have different sizes and different configurations. In this manner, the insulator 8 is interposed between the evaporation sections 1 and the condenser tubular bodies 5.