To provide electroconductive electroless plated powder which has a low resistance value and a sharp grain size distribution, and can obtain sufficient conduction even in the case the number of particles interposed between the electrodes is small.
The electroconductive electroless plated powder 1 is obtained by forming an electroless plating layer on the surface of the spherical core material powder 2 of a nonmetallic material having no electroconductivity. The electroless plating layer has a multilayer structure comprising a gold layer 3 located on the uppermost layer and a nickel layer 4. The nickel layer 4 is the thin one having a thickness t2 of 0.1 to 50 nm, and also, the thickness t1 of the gold layer 3 is 0.5 to 150 times the thickness t2 of the nickel layer. In the electroless plating layer, the total thickness t is 20 to 100 nm. In the plated powder 1, the initial volume resistivity value measured under the condition of 20°C/65%RH is 0.01 to 10 mΩ cm.
ABE SHINJI
INABA HIROYUKI
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Yoshiyuki Matsushima
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