ELECTROCONDUCTIVE METALLIC BAND AND CONNECTOR

Title:

ELECTROCONDUCTIVE METALLIC BAND AND CONNECTOR

Document Type and Number:

Japanese Patent JP2002020825

Kind Code:

A

Abstract:

To provide an electroconductive contact member improving the adhesiveness between a base material and a coating and further ensuring required temperature stability, surface hardness, good sliding characteristics and stable contact resistance, particularly an electroconductive metallic band for manufacturing a connector.

The coating in copper and a copper alloy is composed of a tin-silver alloy containing silver in the ratio of 1 to 3.8 wt.%, by which its adhesive strength is improved, and further, its temperature stability is increased. As the copper alloy in the base, the one containing, by weight, 1 to 4% Ni, 0.08 to 1% Si, <1% tin and <2% zinc is desirable, and it is also effective that the alloy further contains 0.02 to 0.5% silver, 0.005 to 0.05% Zr, <0.1% Mg, <0.05% P and <0.1% Fe.

Inventors:

SCHLEICHER KLAUS (DE)
RUMBACH ALBERT (DE)
GEBHARDT JUERGEN (DE)
ADLER UDO (DE)

Application Number:

JP2001149478A

Publication Date:

January 23, 2002

Filing Date:

May 18, 2001

Export Citation:

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Assignee:

STOLBERGER METALLWERKE GMBH (DE)

International Classes:

B32B15/01; C22C9/02; C22C9/06; C22C13/00; H01B1/02; H01B5/02; H01R13/03; (IPC1-7): C22C13/00; C22C9/02; C22C9/06; H01B1/02; H01B5/02

Domestic Patent References:

JPH08176883A	1996-07-09
JP2000073130A	2000-03-07
JPH05279825A	1993-10-26
JPH06145847A	1994-05-27
JPS63241131A	1988-10-06

Attorney, Agent or Firm:

Mitsufumi Ezaki (3 others)

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