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Title:
ELECTROCONDUCTIVE THIN RESIN MOLDING
Document Type and Number:
Japanese Patent JPH0987417
Kind Code:
A
Abstract:

To obtain the subject molding excellent in electroconductivity and rigidity required as a casing material, comprising a matrix resin consisting essentially of a thermoplastic resin and electroconductive fibers of specific length existing in a specific state.

A matrix resin consisting essentially of a thermoplastic resin and an electroconductive composite material prepared by combining (A) electroconductive fibers (preferably carbon fibers having 5-15μm diameter) with (B) carbon black are molded in ≤2mm thickness. When the whole resin components are removed from a molding by a method in which a test piece (5cm×5cm) is retained at 40°C for 40 minutes in an atmosphere of a mixed gas of air and nitrogen in the volume ratio of 1:1, heated at 5°C/minute heating rate to 450°C and kept at 450°C for 20 minutes, the average length of the fibers A remaining after the removal is ≥0.5mm and the fibers A are three- dimensionally superimposed. The electroconductive composite material comprises preferably 10-40wt.% of the fibers A and 1-20% of the carbon black B.


Inventors:
HIRANO YASUO
HASHIMOTO KOICHI
KIKUCHI NAOKI
SHINO IKOU
TANAKA KEIKO
Application Number:
JP24488695A
Publication Date:
March 31, 1997
Filing Date:
September 22, 1995
Export Citation:
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Assignee:
KOBE STEEL LTD
International Classes:
B32B5/02; B32B7/02; B32B27/34; B32B27/42; C08K3/02; C08K3/04; C08K7/00; C08K7/02; C08L61/04; C08L61/06; C08L77/00; C08L101/00; H05K9/00; (IPC1-7): C08K3/04; B32B5/02; B32B7/02; B32B27/34; B32B27/42; C08K7/02; C08L61/06; C08L77/00; C08L101/00; H05K9/00
Attorney, Agent or Firm:
Ueki Kuichi